|
🦁
|
Flux effect on void quantity and size in soldered joints
7 auth.
D. Bušek,
Karel Dušek,
D. Ruzicka,
M. Plaček,
Pavel Mach,
J. Urbánek,
...
J. Starý
|
6 |
2016 |
6
🦁
|
|
🐜
|
Solder joint quality evaluation based on heating factor
11 auth.
P. Veselý,
E. Horynová,
J. Starý,
D. Bušek,
K. Dušek,
V. Zahradník,
...
M. Plaček,
P. Mach,
Martin Kučírek,
Vladimír Ježek,
Milan Dosedla
|
4 |
2018 |
4
🐜
|
|
🐢
|
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
B. Illés,
A. Skwarek,
A. Géczy,
O. Krammer,
D. Bušek
|
4 |
2017 |
4
🐢
|
|
🐬
|
Analysis of no-clean flux spatter during the soldering process
P. Veselý,
D. Bušek,
Olivér Krammer,
Karel Dušek
|
4 |
2020 |
4
🐬
|
|
🐢
|
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
B. Illés,
A. Géczy,
A. Skwarek,
D. Bušek
|
4 |
2016 |
4
🐢
|
|
🐬
|
Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy
B. Illés,
Halim Choi,
T. Hurtony,
K. Dušek,
D. Bušek,
A. Skwarek
|
4 |
2022 |
4
🐬
|
|
🐢
|
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
K. Dušek,
D. Bušek
|
4 |
2016 |
4
🐢
|
